DB FIB/EDS

Dual Beam

Dual Beam

Precision cut for the defectives for different kinds of material.
Sample preparation for TEM, SEM, SSRM and special request.
Mirco-probing system for advantage application.

–FIB analysis on Samsung S5KGW2 BSI image sensor

(HOT!!) Advanced Equipment (FEI / Helios Dual- Beam) x 22

–FIB(Dual Beam) Capability

Low energy benefits: lithographic resist

● At 1 kV, immediate shrinking and distortion

● stable at 500V

● Better Material and grain orientation contrast(SEI)

● To peruse higher resolution in low KV MSS has best SEM resolution 0.8nm@2KV

▍Eng. Contact Window

Ms. Chen ext.6211
E-mail: lynn_chen@msscorps.com