2D 3D X-ray

3D X-ray

  • ★reselotion down to 500nm
  • • Non-destructive sub-micron scale microscopy of intact samples
  • • Higher flux and faster scans without compromising resolution
  • • True spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm
  • • High resolution across a broad range of sample types, sizes, and working distances
  • • In situ imaging for non-destructive characterization of microstructures in controlled environments and over time

– Asus Zenfone 3D X-ray results


▍Eng. Contact Window

Mr. Wu ext.3010

The X-Ray has very short wave length and high electromagnetic radiation.
When the sample location cannot be inspected using external appearance related metrology tools, X-Ray imaging can be used to detect the internal structure of the sample due to its intensity change as a function of material density. This contrast image can show the internal structure of the sample without any physical destruction to the diagnosed region.


MSS has the newest X-ray equipmet — QUADRA 7 (Nordson DAGE) and FSX-90.

Figure-1. QUADRA 7

Figure-2. FSX-90

– Specification

  • • Sample size:45X40X10(CM)/10kg
  • • Power:30~160(KV)
  • • Maximum inclination is 70 degrees, 360 degrees rotation
  • • Resolution up to 0.1um
  • • Machine for real-time observation of images

– Applications

  • • Defect inspection in IC packaging﹕ layer delamination, burst Crack, void, and bonding inspection.
  • • Potential defects in the PCB manufacturing process e.g.: mis-alignment, bridge or open circuit.
  • • SMT solding void inspection and measurement.
  • • Inspection of crack in high density plastic material or void in metal.
  • • Solder ball array inspection in BGA packaging and flip chip packaging.

– Case Sharing

  • • Wire&pad burn out
  • • 1ST and 2nd bond lift
  • •Wire bonding observation
  • • Bump adhesion interface inspection
  • • Mobile phone internal components inspection
  • • Crack
  • • front-side
  • • L/F bridge


▍Eng. Contact Window

Mr. Wu ext.3010