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Service

Service

3D Laser confocal profile
AFM
CP
CEF
SEM/EDS
DB FIB/EDS
TEM/EDS
Liquid TEM
  • Material Analysis
    • 3D Laser confocal profile
    • AFM
    • CP
    • CEF
    • SEM/EDS
    • DB FIB/EDS
    • TEM/EDS
    • Liquid TEM
  • IC Circuit Repair
    • IC Circuit Repair
  • Decap
    • X-ray
    • SAT
    • Laser Decap
    • Delayer
  • EFA Analysis
    • Nano Prober System
    • OBIRCH
    • EMMI/InGaAs
  • Case Study
    • Inside of A 7 nm Technology Node Application Processor
    • MSS new high-end Hitachi Regulus 8220 SEM released for service
    • 10 nm vs 10 nm technology node comparison
    • EDS & EELS
    • A new CP method, curtain effect free (CEF), for heterogeneous materials
    • SEM and SEM/EDS investigation on a Samsung Galaxy S8 10 nm CPU chip
    • Intel 14nm vs.14nm plus

ABOUT US

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SERVICE

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  • Decap
  • EFA Analysis
  • Case Study

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NEWS

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MSSCORPS CO., LTD.

24hr Pick-up Delivery Service

+886-972-302-203

1F, No.27, Pu-ding Rd., Hsin-chu 30072, Taiwan, R.O.C.

TEL +886-3-6663298

FAX +886-3-6663190

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