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3D Laser confocal profile
AFM
XPS
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CP
CEF
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PFIB
  • Materials Analysis
    • 3D Laser confocal profile
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    • Liquid TEM
  • IC Circuit Repair
    • IC Circuit Repair
  • Failure Analysis
    • Thermal EMMI (InSb)
    • Nano Prober System
    • EMMI/InGaAs
    • OBIRCH
  • Chemical Engineering Analysis
    • X-ray
    • 3D OM
    • SAT
    • Laser Decap
    • Delayer
  • Case Study
    • #How to use angle resolved XPS to determine precise chemical composition of super-thin films
    • #Advanced electron microscope imaging technology for unveiling VCSEL fabrication process details
    • #Reverse Engineering on Qualcomm Snapdragon 855(SM8150)
    • #Reverse engineering on Samsung vertical NAND SSD – 970 EVO Plus
    • #MSS Backside FIB circuit edit
    • #MSS SEM Analysis In Our Daily Life
    • #Inside of A12: 7 nm Technology Node Application Processor
    • #MSS new high-end Hitachi Regulus 8220 SEM released for service
    • #10 nm vs 10 nm technology node comparison
    • #EDS & EELS
    • #A new CP method, curtain effect free (CEF), for heterogeneous materials
    • #SEM and SEM/EDS investigation on a Samsung Galaxy S8 10 nm CPU chip
    • #Intel 14nm vs.14nm plus

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MSSCORPS CO., LTD.

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+886-972-302-203

8F, No.178, Section 2, Gongdao 5th Rd., Hsin-chu 30070, Taiwan, R.O.C.

TEL +886-3-6663298

FAX +886-3-6663190

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