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Service

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3D Laser confocal profile
AFM
XPS
SIMS
CP
CEF
SEM/EDS
DB FIB/EDS
  • Material Analysis
    • 3D Laser confocal profile
    • AFM
    • XPS
    • SIMS
    • CP
    • CEF
    • SEM/EDS
    • DB FIB/EDS
    • TEM/EDS
    • Liquid TEM
  • IC Circuit Repair
    • IC Circuit Repair
  • Failure Analysis
    • Thermal EMMI (InSb)
    • Nano Prober System
    • EMMI/InGaAs
    • OBIRCH
  • Chemical Engineering Analysis
    • X-ray
    • 3D OM
    • SAT
    • Laser Decap
    • Delayer
  • Case Study
    • Reverse engineering on Samsung vertical NAND SSD – 970 EVO Plus
    • MSS Backside FIB circuit edit
    • MSS SEM Analysis In Our Daily Life
    • Inside of A12: 7 nm Technology Node Application Processor
    • MSS new high-end Hitachi Regulus 8220 SEM released for service
    • 10 nm vs 10 nm technology node comparison
    • EDS & EELS
    • A new CP method, curtain effect free (CEF), for heterogeneous materials
    • SEM and SEM/EDS investigation on a Samsung Galaxy S8 10 nm CPU chip
    • Intel 14nm vs.14nm plus

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MSSCORPS CO., LTD.

24hr Pick-up Delivery Service

+886-972-302-203

8F, No.178, Section 2, Gongdao 5th Rd., Hsin-chu 30070, Taiwan, R.O.C.

TEL +886-3-6663298

FAX +886-3-6663190

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