X-ray

The X-Ray has very short wave length and high electromagnetic radiation.

When the sample location cannot be inspected using external appearance related metrology tools, X-Ray imaging can be used to detect the internal structure of the sample due to its intensity change as a function of material density. This contrast image can show the internal structure of the sample without any physical destruction to the diagnosed region.

▍Equipment

MSS has the newest X-ray equipmet — QUADRA 7 (Nordson DAGE) and FSX-90.

Figure-1. QUADRA 7

Figure-2. FSX-90

▍Specification

▪ Sample size:45X40X10(CM)/10kg

▪ Power:30~160(KV)

▪ Maximum inclination is 70 degrees, 360 degrees rotation

▪ Resolution up to 0.1um

▪ Machine for real-time observation of images

▍Applications

▪ Defect inspection in IC packaging﹕ layer delamination, burst Crack, void, and bonding inspection.
▪  Potential defects in the PCB manufacturing process e.g.: mis-alignment, bridge or open circuit.
▪  SMT solding void inspection and measurement.
▪  Inspection of crack in high density plastic material or void in metal.
▪  Solder ball array inspection in BGA packaging and flip chip packaging.

▍Case Sharing

▪ Wire&pad burn out