IC Delayer Process
MSS (Material Science Service) is capable to delayer all the metals and poly layer of 40nm Cu process, the exposed area is reaching 90%.
IC Delayer Method
Using different methods such as RIE, Chemical Etching and Polishing，We can also selectivity remove layers in multilayer structures. Furthermore, we can remove layers one by one in reverse engineering. We can also reverse engineer a printed circuit board to determine how the components are interconnected. Multi-layer boards are analyzed by X-Ray examination or delaminated and imaged to determine how the inner traces are routed and connected.
Eng. Contact Window
Mr. Wu ext.3677